Solidigm Plans $45B US Chip Plant to Upgrade China Facility

• Solidigm Inc., an American subsidiary of SK Hynix, plans to invest $45 billion in a new US chip plant.
• The new plant aims to upgrade an existing facility in China.
• SK Hynix has secured construction permits for an Indiana AI memory facility.
• Advanced chip packaging at the Indiana facility is scheduled to begin in 2029.
• The investment is part of a broader strategy to enhance chip production capabilities.