Samsung to use TSMC's 3nm process for Nvidia's memory chips

• Samsung will use TSMC's 3nm process for a core part of Nvidia's custom memory chips.
• This marks the first collaboration between Samsung and TSMC on high-bandwidth memory (HBM).
• The report was published by the Seoul Economic Daily and cited by Reuters.
• The move is aimed at enhancing the performance of Nvidia's next-generation memory chips.
• The base die, or logic layer, of the memory chips will be manufactured using TSMC's technology.